It is also the first working variant of HBM3 memory, the next generation after HBM2E, which began mass production in summer 2020.

SK Hynix HBM3 memory bandwidth is 819 GB / s, which is almost 80% faster than HBM2E. In theory, if the processor is connected to 4 modules of such memory on a 4096-bit bus, then the total bandwidth will exceed 3 TB / s.

According to the manufacturer, HBM3 stacks will be available in 2 versions: 16 or 24 GB (an industry record). The memory chip has a height of 30 microns (thinner than paper).

Unfortunately, there is no information about when HBM3 memory will begin to be used en masse in technology. But it is definitely not worth expecting its appearance in serial devices this year. And maybe even the next one. We put on 2023.

From other interesting news: deliveries of accelerators with multi-chip GPUs from AMD have started.

Source: SK Hynix

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